HARTING 3D-MID Component Carriers – Electronics-Lab.com

HARTING 3D-MID Component Carriers enable alternative component positioning and mounting utilizing fully automated assembly and soldering. These 3D molded interconnect devices can replace circuit boards utilizing a 3-dimensional circuit on molded plastic. This 3D shape can allow for more compact integration of electrical components into the available space. HARTING 3D-MID Component Carriers utilize a high-temperature thermoplastic, enabling compatibility with reflow soldering.


  • Universal design of substrate
  • Customized layout for traces
  • High-temperature plastic for reflow soldering
  • Shipped in tape and reel as sub-assembly for fully automated SMT processing

more information: https://www.harting.com/DE/en-gb/company/harting-ag-3d-mid

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